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Director 主持人簡介
蔡明義 教授兼系主任 |
最高學歷:美國維吉尼亞理工大學 工程科學暨力學博士 研究領域:電子/光電構裝、高分子複合材料、接合力學、 實驗力學、光學量測 聯絡方式:電話 :(03)211-8800 分機 5743 e-mail: [email protected] 實 驗 室 :電子構裝實驗室 分機 5809 |
簡歷:
●學歷:
美國維吉尼亞理工大學 工程科學暨力學 博士
美國維吉尼亞理工大學 工程科學暨力學 碩士
國立成功大學 學士
●經歷:
長庚大學 教授 (2006/8~迄今)
長庚大學 副教授 (1997/8~2006/7)
台灣大學慶齡研究中心 高分子複材研究群 研究員 (1996/9-1997/7)
美國維吉尼亞理工大學 工程科學暨力學系 研究員 (1993/9-1996/9)
美國維吉尼亞理工大學工程科學暨力學系 博士後副研究員 (1990/12-1993/9)
美國維吉尼亞理工大學 工程科學暨力學 博士
美國維吉尼亞理工大學 工程科學暨力學 碩士
國立成功大學 學士
●經歷:
長庚大學 教授 (2006/8~迄今)
長庚大學 副教授 (1997/8~2006/7)
台灣大學慶齡研究中心 高分子複材研究群 研究員 (1996/9-1997/7)
美國維吉尼亞理工大學 工程科學暨力學系 研究員 (1993/9-1996/9)
美國維吉尼亞理工大學工程科學暨力學系 博士後副研究員 (1990/12-1993/9)
近五年國內外之成就與榮譽:
在學術研究方面,早期以雷射光干涉原理與方法、用於研究複合材料及膠著接合之力學行為的領域為主,近十幾年來跨入電子/光電構裝的研究,目前已略有成果,陸陸續續投稿於國際著名學術期刊,其中部分已被刊出,另部分已接受刊出中。自出道迄今已發表百餘篇論文於不同國際會議及國外著名期刊,且曾擔任國內外知名學術期刊的論文審核(如 IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing, Microelectronics Reliability, Transaction of ASME, J. of Electronic Packaging, International Journal of Solids and Structures, Journal of Composite Materials, Experimental Mechanics, Journal of Adhesion, Journal of Mechanics, The Chinese Journal of Mechanics等)的論文審核。
擔任 Conference Session Chair:
1. IMAPS2006, Taipei, Taiwan (2006)
2. EMAP2006, Hong Kong (2006)
3. IMPACT2007, Taiwan (2007)
4. EMAP2007, Daejeon, South Korea (2007)
5. IMPACT/EMAP2008, Taipei, Taiwan (2008) and Invited Speaker
6. IMPACT2009, Taipei, Taiwan (2009) and Invited Speaker
7. EMAP2009, Penang, Malaysia (2009)
8. IMPACT2010, Taipei, Taiwan (2010)
9. IMPACT2011, Taipei, Taiwan (2011)
10. EMAP2011, Kyoto, Japan (2011)
2. EMAP2006, Hong Kong (2006)
3. IMPACT2007, Taiwan (2007)
4. EMAP2007, Daejeon, South Korea (2007)
5. IMPACT/EMAP2008, Taipei, Taiwan (2008) and Invited Speaker
6. IMPACT2009, Taipei, Taiwan (2009) and Invited Speaker
7. EMAP2009, Penang, Malaysia (2009)
8. IMPACT2010, Taipei, Taiwan (2010)
9. IMPACT2011, Taipei, Taiwan (2011)
10. EMAP2011, Kyoto, Japan (2011)
指導學生國際學術研討會獲獎:
1. C. Y. Huang, T. D. Li and M. Y. Tsai, “Warpage Measurement and Design of wBGA
Package under Thermal Loading,” IMPACT2009, Taipei, Taiwan (2009).
(Best Student Paper Award 最佳學生論文獎 )
2. C. C. Lin, X. H. Qian, L. B. Chang, C. Y. Tang, and M. Y. Tsai, “Fabrication and Thermal
Analysis of Flip Chip Light Emitting Diodes with Different Numbers of Au Stub
Bumps,” EDMS2009, Taiwan. (Best Paper Award 最佳論文獎 )
3. P. S. Huang, Y. H. Lin, C.Y Huang, M.Y. Tsai T. C. Huang and M.C. Liao, “Warpage and
Curvature Determination of PCB with DIMM Socket During Reflow Process by Strain
Gage Measurement,” IMPACT 2010, Taipei, Taiwan. (PCB優良論文獎)
Package under Thermal Loading,” IMPACT2009, Taipei, Taiwan (2009).
(Best Student Paper Award 最佳學生論文獎 )
2. C. C. Lin, X. H. Qian, L. B. Chang, C. Y. Tang, and M. Y. Tsai, “Fabrication and Thermal
Analysis of Flip Chip Light Emitting Diodes with Different Numbers of Au Stub
Bumps,” EDMS2009, Taiwan. (Best Paper Award 最佳論文獎 )
3. P. S. Huang, Y. H. Lin, C.Y Huang, M.Y. Tsai T. C. Huang and M.C. Liao, “Warpage and
Curvature Determination of PCB with DIMM Socket During Reflow Process by Strain
Gage Measurement,” IMPACT 2010, Taipei, Taiwan. (PCB優良論文獎)
國際學術合作計畫:
1. Prof. M. Pecht (Director, IEEE and ASME Fellow), CALCE, U. of Maryland, USA,
“Evaluation of PCB Reliability” (2008~now)
2. Prof. Ricky, Lee (Director, IEEE and ASME Fellow), EPACK, Hong Kong University of
Science and Technology, “Development of Warpage Measurement
System,” (2008~2009)
“Evaluation of PCB Reliability” (2008~now)
2. Prof. Ricky, Lee (Director, IEEE and ASME Fellow), EPACK, Hong Kong University of
Science and Technology, “Development of Warpage Measurement
System,” (2008~2009)
近五年在人才培育、研究團隊建立及服務方面的重要貢獻及成就:
近五年內,本研究室透過執行國科會學術研究計畫與產學合作研究計畫已培養出 20位理論與實務兼具能力之碩士畢業生,其中五位繼續攻讀博士學位,其他分別在國內電子及光電構裝產業界服務,因學以致用,皆有傑出的表現。
主持人擔任經濟部技審委員(2009~)。指導學生於2009兩次與2010一次國際學術研討會中獲得最佳論文獎。已發表重要期刊論文(前10篇)五年內被引用共265次。其中兩篇分別被引用累積共110次與92次之多。亦分別與香港科技大學電子構裝中心(EPACK)與美國馬里蘭大學電腦輔助產品壽命週期工程中心(CALCE)進行國際學術研究合作與交流,並共同發表國際學術期刊論文。
主持人擔任經濟部技審委員(2009~)。指導學生於2009兩次與2010一次國際學術研討會中獲得最佳論文獎。已發表重要期刊論文(前10篇)五年內被引用共265次。其中兩篇分別被引用累積共110次與92次之多。亦分別與香港科技大學電子構裝中心(EPACK)與美國馬里蘭大學電腦輔助產品壽命週期工程中心(CALCE)進行國際學術研究合作與交流,並共同發表國際學術期刊論文。
已發表重要期刊論文、書籍、重要國際會議論文:
1. Tsai, M. Y., Hsu, C. H. and Wang, C. T., “Investigation of Thermomechanical Behaviors
of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling,” IEEE
Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-
576,2004. (SCI/EI)
2. Tsai, M. Y., Lin, Y. C., Huang, C. Y and Wu, J. D., “Thermal Deformations and Stresses of
Flip Chip BGA Packages with Low- and High-Tg Underfills,” IEEE Transactions on
Electronics Packaging Manufacturing, Vol. 28,No. 4, pp.328-337, 2005. (SCI/EI))
3. Tsai, M. Y., Wu, C. Y., Huang, C. Y., Cheng, W. C., and Yang, S. S., “Study of Some
Parameters Effect on Warpage and Bump-Joint Stresses of COG Packages,” IEEE
Transactions on Advanced Packaging, Vol. 29, No.3 pp. 587-598, 2006. (SCI/EI))
4. Tsai, M. Y., Wang, C. T. and Hsu, C. H., “The Effect of Epoxy Molding Compound on
Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing
Process,” IEEE Transactions on Components and Packaging Technologies, Vol. 29, No.
3, pp. 625-635, Sept. 2006. (SCI/EI)
5. Tsai, M. Y., Chen, C. H. and Lin, C. S., “Test Methods for Silicon Die Strength,”
Transaction of ASME, J. of Electronic Packaging, Vol. 128, pp. 419-426, Dec. 2006.
(SCI/EI)
6. Tsai, M. Y. and Lin, C. S., “Testing and Evaluation of Silicon Die Strength,” IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 30, No. 2, pp. 106-114,
April. 2007 (SCI/EI)
7. Tsai, M. Y., Huang, C. Y., Chiang, C. Y., Chen, W. C., and Yang, S. S. “Experimental and
Numerical Studies of Warpages of ACF-bonded COG Packages Induced from
Manufacturing and Thermal Cycling,” IEEE Transactions on Advanced Packaging, Vol.
30, No. 4,pp. 665-673, Nov. 2007 (SCI/EI).
8. Tsai, M. Y., Huang, C. Y., Chiang, C. Y., Chen, W. C., and Yang, S. S. “Hygro-Thermal
Warpages of COG Package with Non-Conductive Paste Adhesive,” IEEE Transactions
on Components and Packaging Technologies, Vol. 30, No. 3, pp. 517-525, Sept. 2007.
(SCI/EI)
9. Tsai, M. Y., Chen, Y. C., and Lee, S. W. Ricky, “Correlation between Measurement and
Simulation of Thermal Warpage in PBGA with Consideration of Molding Compound
Residual Strain,” IEEE Transactions on Components and Packaging Technologies, Vol.
31, No. 3, pp. 683-688, Sept. 2008 (SCI/EI).
10. Tsai, M. Y., Wu, C. Y., Huang, C. Y., and Yang, S. S., “Transient Stress Distributions in
NCF-Bonded COG Packages due to Moisture Diffusion,” IEEE Transactions on
Advanced Packaging, Vol. 31, No. 3, pp. 454-462 ,Aug. 2008. (SCI/EI).
11. Tsai, M. Y., Chang, H. Y. and Pecht, M. “Warpage Analysis of Flip-Chip PBGA
Packages Subject to Thermal Loading,” IEEE Transactions on Device and Materials
Reliability, Vol. 9, No. 3, pp.419-424, Sept. 2009(SCI/EI).
12. Tsai, M. Y., Chiang, C. Y. C., Huang, Y. and Yang, S. S., “Residual Strain Measurement
of Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic
Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33,
No. 1, pp.71-78,Mar. 2010 (SCI/EI).
13. Tsai, M. Y. and Morton, J., “An Investigation into the Stresses in Double-Lap
Adhesive Joints with Laminated Composite Adherends,” Int. J. Solids and Structures,
No. 47, pp. 3317-3325, 2010. (SCI/EI).
14. M. Y. Tsai, C. H. Chen, and C. S. Kang, “Thermal Measurements and Analyses of Low-
Cost High-Power LED Package,” Microelectronics Reliability, vol. 52, p. 845-854,
2012 (SCI/EI).
15. C. H. Chen and M. Y. Tsai, “Strength Determination of High-Power LED Die Using
Point-Load and Line-Load Tests” Microelectronics Reliability, Vol. 52, p. 822-829,
2012 (SCI/EI).
16. M. Y. Tsai*, C. W. Ting, C. Y. Huang, and Yi-Shao Lai, “Determination of Residual
Strains of the EMC in PBGA during Manufacturing and IR Solder Reflow Processes,”
Microelectronics Reliability, vol.51,pp.642–648, 2011.(SCI, Engineering, Electrical
and Electronics)
17. M. Y. Tsai* and J. Morton, “An Investigation into the Stresses in Double-Lap Adhesive
Joints with Laminated Composite Adherends,” Int. J. Solids and Structures, No. 47,
pp. 3317-3325, 2010. (SCI/EI), (Mechanics)
18. M. Y. Tsai*, C. H. Chen, and W. L. Tsai, “Thermal Resistance and Reliability of High-
Power LED Packages under WHTOL and Thermal Shock Tests,” IEEE Transactions on
Components and Packaging Technologies, Vol. 33, No. 4, pp. 738-746, Dec.
2010. (SCI, Engineering,Manufacturing)
19. M. Y. Tsai*, C. Y. Chiang, C. Y. Huang, and S. S. Yang, “Residual Strain Measurement of
Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic
Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33,
No. 1, pp.71-78, Mar. 2010 (SCI, Engineering,Manufacturing)
20.Tsai, M. Y.*, Chang, H. Y. and Pecht, M., “Warpage Analysis of Flip-Chip PBGA
Packages Subject to Thermal Loading,” IEEE Transactions on Device and
Materials Reliability, Vol. 9, No. 3, pp.419-424,Sept. 2009 (SCI, Engineering, Electrical
and Electronics)
of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling,” IEEE
Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-
576,2004. (SCI/EI)
2. Tsai, M. Y., Lin, Y. C., Huang, C. Y and Wu, J. D., “Thermal Deformations and Stresses of
Flip Chip BGA Packages with Low- and High-Tg Underfills,” IEEE Transactions on
Electronics Packaging Manufacturing, Vol. 28,No. 4, pp.328-337, 2005. (SCI/EI))
3. Tsai, M. Y., Wu, C. Y., Huang, C. Y., Cheng, W. C., and Yang, S. S., “Study of Some
Parameters Effect on Warpage and Bump-Joint Stresses of COG Packages,” IEEE
Transactions on Advanced Packaging, Vol. 29, No.3 pp. 587-598, 2006. (SCI/EI))
4. Tsai, M. Y., Wang, C. T. and Hsu, C. H., “The Effect of Epoxy Molding Compound on
Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing
Process,” IEEE Transactions on Components and Packaging Technologies, Vol. 29, No.
3, pp. 625-635, Sept. 2006. (SCI/EI)
5. Tsai, M. Y., Chen, C. H. and Lin, C. S., “Test Methods for Silicon Die Strength,”
Transaction of ASME, J. of Electronic Packaging, Vol. 128, pp. 419-426, Dec. 2006.
(SCI/EI)
6. Tsai, M. Y. and Lin, C. S., “Testing and Evaluation of Silicon Die Strength,” IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 30, No. 2, pp. 106-114,
April. 2007 (SCI/EI)
7. Tsai, M. Y., Huang, C. Y., Chiang, C. Y., Chen, W. C., and Yang, S. S. “Experimental and
Numerical Studies of Warpages of ACF-bonded COG Packages Induced from
Manufacturing and Thermal Cycling,” IEEE Transactions on Advanced Packaging, Vol.
30, No. 4,pp. 665-673, Nov. 2007 (SCI/EI).
8. Tsai, M. Y., Huang, C. Y., Chiang, C. Y., Chen, W. C., and Yang, S. S. “Hygro-Thermal
Warpages of COG Package with Non-Conductive Paste Adhesive,” IEEE Transactions
on Components and Packaging Technologies, Vol. 30, No. 3, pp. 517-525, Sept. 2007.
(SCI/EI)
9. Tsai, M. Y., Chen, Y. C., and Lee, S. W. Ricky, “Correlation between Measurement and
Simulation of Thermal Warpage in PBGA with Consideration of Molding Compound
Residual Strain,” IEEE Transactions on Components and Packaging Technologies, Vol.
31, No. 3, pp. 683-688, Sept. 2008 (SCI/EI).
10. Tsai, M. Y., Wu, C. Y., Huang, C. Y., and Yang, S. S., “Transient Stress Distributions in
NCF-Bonded COG Packages due to Moisture Diffusion,” IEEE Transactions on
Advanced Packaging, Vol. 31, No. 3, pp. 454-462 ,Aug. 2008. (SCI/EI).
11. Tsai, M. Y., Chang, H. Y. and Pecht, M. “Warpage Analysis of Flip-Chip PBGA
Packages Subject to Thermal Loading,” IEEE Transactions on Device and Materials
Reliability, Vol. 9, No. 3, pp.419-424, Sept. 2009(SCI/EI).
12. Tsai, M. Y., Chiang, C. Y. C., Huang, Y. and Yang, S. S., “Residual Strain Measurement
of Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic
Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33,
No. 1, pp.71-78,Mar. 2010 (SCI/EI).
13. Tsai, M. Y. and Morton, J., “An Investigation into the Stresses in Double-Lap
Adhesive Joints with Laminated Composite Adherends,” Int. J. Solids and Structures,
No. 47, pp. 3317-3325, 2010. (SCI/EI).
14. M. Y. Tsai, C. H. Chen, and C. S. Kang, “Thermal Measurements and Analyses of Low-
Cost High-Power LED Package,” Microelectronics Reliability, vol. 52, p. 845-854,
2012 (SCI/EI).
15. C. H. Chen and M. Y. Tsai, “Strength Determination of High-Power LED Die Using
Point-Load and Line-Load Tests” Microelectronics Reliability, Vol. 52, p. 822-829,
2012 (SCI/EI).
16. M. Y. Tsai*, C. W. Ting, C. Y. Huang, and Yi-Shao Lai, “Determination of Residual
Strains of the EMC in PBGA during Manufacturing and IR Solder Reflow Processes,”
Microelectronics Reliability, vol.51,pp.642–648, 2011.(SCI, Engineering, Electrical
and Electronics)
17. M. Y. Tsai* and J. Morton, “An Investigation into the Stresses in Double-Lap Adhesive
Joints with Laminated Composite Adherends,” Int. J. Solids and Structures, No. 47,
pp. 3317-3325, 2010. (SCI/EI), (Mechanics)
18. M. Y. Tsai*, C. H. Chen, and W. L. Tsai, “Thermal Resistance and Reliability of High-
Power LED Packages under WHTOL and Thermal Shock Tests,” IEEE Transactions on
Components and Packaging Technologies, Vol. 33, No. 4, pp. 738-746, Dec.
2010. (SCI, Engineering,Manufacturing)
19. M. Y. Tsai*, C. Y. Chiang, C. Y. Huang, and S. S. Yang, “Residual Strain Measurement of
Thin-Layer Cured Adhesives and Their Effects on Warpage in Electronic
Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33,
No. 1, pp.71-78, Mar. 2010 (SCI, Engineering,Manufacturing)
20.Tsai, M. Y.*, Chang, H. Y. and Pecht, M., “Warpage Analysis of Flip-Chip PBGA
Packages Subject to Thermal Loading,” IEEE Transactions on Device and
Materials Reliability, Vol. 9, No. 3, pp.419-424,Sept. 2009 (SCI, Engineering, Electrical
and Electronics)
Highly Cited 著作:
1. J. Morton, H. Ho, M.Y. Tsai and G.L. Farley, "An Evaluation of The Iosipescu Specimen
for Composite Materials Shear Property Measurement," Journal of Composite Materials.
Vol. 26, No. 5, pp.708-750, (1992). (Citations=41)
2. Tsai, M. Y. and Morton, J., "An Evaluation of Analytical and Numerical Solutions to the
Single-lap Joint," Int. J. of Solid and Structures Vol. 31, No. 18, pp.2537-2563, 1994.
(Citations = 95)
3. Tsai, M. Y. and Morton, J. and Matthews, F. L., "Experimental and Numerical Studies of a
Laminated Composite Single-Lap Adhesive Joint," J. Composite Materials. Vol. 29, No. 9,
pp.1154-1275, (1995). (Citations=43)
4. Tsai, M. Y. and Morton, J., "The Effect of a Spew Fillet on Adhesive Stress Distributions in
Laminated Composite Single-Lap Joints," Composite Structures, Vol. 32, pp.123-131,
(1995). (Citations = 62)
5. Tsai, M. Y., Oplinger, D. W. and Morton, J., " Improved Theoretical Solutions of
Adhesive Joints, " Int. J. Solids and Structures, Vol. 35, No. 12, pp.1163-1185, 1998.
(Citations = 123)
6.Tsai, M. Y. Hsu, C. H. and Wang, C. T., “Investigation of Thermomechanical Behaviors of
Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling,” IEEE
Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-576, 2004.
(Citations = 45)
7. Tsai, M. Y., Hsu, C. H. and Han, C. N., “A Note on Suhir’s Solution of Thermal Stresses a
Die-Substrate Assembly, “Transaction of ASME, J. of Electronic Packaging, Vol. 126,
pp.115-119, March 2004. (Citations = 32)
8. Tsai, M. Y. Wang, C. T. and Hsu, C. H., “The Effect of Epoxy Molding Compound on
Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing
Process,” IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3,
pp. 625-635, Sept. 2006. (Citations = 19)
for Composite Materials Shear Property Measurement," Journal of Composite Materials.
Vol. 26, No. 5, pp.708-750, (1992). (Citations=41)
2. Tsai, M. Y. and Morton, J., "An Evaluation of Analytical and Numerical Solutions to the
Single-lap Joint," Int. J. of Solid and Structures Vol. 31, No. 18, pp.2537-2563, 1994.
(Citations = 95)
3. Tsai, M. Y. and Morton, J. and Matthews, F. L., "Experimental and Numerical Studies of a
Laminated Composite Single-Lap Adhesive Joint," J. Composite Materials. Vol. 29, No. 9,
pp.1154-1275, (1995). (Citations=43)
4. Tsai, M. Y. and Morton, J., "The Effect of a Spew Fillet on Adhesive Stress Distributions in
Laminated Composite Single-Lap Joints," Composite Structures, Vol. 32, pp.123-131,
(1995). (Citations = 62)
5. Tsai, M. Y., Oplinger, D. W. and Morton, J., " Improved Theoretical Solutions of
Adhesive Joints, " Int. J. Solids and Structures, Vol. 35, No. 12, pp.1163-1185, 1998.
(Citations = 123)
6.Tsai, M. Y. Hsu, C. H. and Wang, C. T., “Investigation of Thermomechanical Behaviors of
Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling,” IEEE
Transactions on Components and Packaging Technologies Vol. 27, No. 3, pp.568-576, 2004.
(Citations = 45)
7. Tsai, M. Y., Hsu, C. H. and Han, C. N., “A Note on Suhir’s Solution of Thermal Stresses a
Die-Substrate Assembly, “Transaction of ASME, J. of Electronic Packaging, Vol. 126,
pp.115-119, March 2004. (Citations = 32)
8. Tsai, M. Y. Wang, C. T. and Hsu, C. H., “The Effect of Epoxy Molding Compound on
Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing
Process,” IEEE Transactions on Components and Packaging Technologies, Vol. 29, No. 3,
pp. 625-635, Sept. 2006. (Citations = 19)